发明名称 Uniform dielectric layer and method to form same
摘要 An exemplary embodiment of the present invention discloses a method for forming a forming a storage capacitor having a uniform dielectric film, by a the steps of: forming a bottom electrode of the storage capacitor and an insulation material about the bottom electrode, the bottom electrode comprises a nitridation receptive material and the insulation material comprises a nitridation resistive material; depositing a layer of non-doped silicon to a thickness of 20Å or less over the bottom electrode and the insulation material; converting the silicon layer to a silicon nitride compound; depositing a silicon nitride of uniform thickness directly on the silicon nitride compound while using the silicon nitride compound as a nitride-nucleation enhancing surface; exposing the silicon nitride compound and the silicon nitride layer to an oxidation ambient to form a storage capacitor dielectric film; and then forming a top electrode of the storage capacitor over the storage capacitor dielectric film.
申请公布号 US6525366(B2) 申请公布日期 2003.02.25
申请号 US20010839804 申请日期 2001.04.19
申请人 MICRON TECHNOLOGY, INC. 发明人 DOAN TRUNG
分类号 H01L21/02;H01L21/318;H01L21/321;H01L21/768;H01L21/8242;(IPC1-7):H01L27/108 主分类号 H01L21/02
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