Method for separating metallic material from waste printed circuit boards, and dry distillation apparatus used for waste treatment

摘要

A method for treating waste printed circuit boards, the method has the steps of:heating up for dry-distilling the waste printed circuit boards having copper foil retaining solder in at least a part of the surface, at a temperature of 250° C. or higher;pulverizing the dry-distilled material of the waste printed circuit boards obtained in the heating step; andseparating the pulverized material of the waste printed circuit boards obtained in the pulverizing step, into board resin component and metal component.