发明名称 |
Ground pin concept for singulated ball grid array |
摘要 |
A new ground pin is provided for the testing of BGA devices. This ground pin can be provided in a area of the BGA package that does not interfere with critical regions of the surface of the BGA package. The method and apparatus of the invention are not limited to providing one ground pin but can be extended to use a multiplicity of ground pins.
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申请公布号 |
US6525553(B1) |
申请公布日期 |
2003.02.25 |
申请号 |
US20000659729 |
申请日期 |
2000.09.11 |
申请人 |
ST ASSEMBLY TEST SERVICES LTD. |
发明人 |
REYNOSO DEXTER;RINGOR RUFINO;LOPEZ FORTUNATO V. |
分类号 |
G01R1/04;G01R31/28;H01L23/498;(IPC1-7):G01R31/02 |
主分类号 |
G01R1/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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