BACK-SURFACE CLEANING METHOD AND APPARATUS, OPERATION CONTROL METHOD AND APPARATUS, AND COMPUTER PROGRAM

摘要

PURPOSE: To properly purify the back-surface of a silicon wafer formed with an integrated circuit; using Cu on the surface. CONSTITUTION: A contaminants, such as Cu or the like adhered to a back surface of a silicon wafer 50 is first removed, by cleaning it with an acid solution, and a compound generated on the back surface of the silicon wafer 50, when cleaning with this acid solution is removed by cleaning with pure water mixed with ozone.