发明名称 |
Photosensitive resin |
摘要 |
A photosensitive resin obtained by reacting a reaction product (I) prepared from a biphenyl epoxy acrylate (a) of the formula (1) and a cyanate ester compound (b) with a polybasic acid anhydride (c), and a photosensitive resin and an epoxy compound,wherein each of R1 and R9 is a hydrogen atom or methyl, and n is an integer of 1 or more. The photosensitive resin and the photosensitive resin composition have excellent developability, has high heat resistance and particularly has excellent heat resistance and reliability on electric insulation under moisture absorption lasting for a long period of time.
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申请公布号 |
US6524769(B1) |
申请公布日期 |
2003.02.25 |
申请号 |
US20000633099 |
申请日期 |
2000.08.04 |
申请人 |
MITSUBISHI GAS CHEMICAL COMPANY, INC. |
发明人 |
ISHII KENJI;HAGIWARA ISAO;HARADA TORU;MIYAMOTO MAKOTO |
分类号 |
G03F7/027;C08F299/02;C08G59/14;C08G59/42;C08G73/00;C08G73/06;C09D179/00;C09J179/00;G03F7/032;G03F7/038;(IPC1-7):G03F7/038;C07C69/54 |
主分类号 |
G03F7/027 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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