| 发明名称 |
Heat sink with alignment and retaining features |
| 摘要 |
An apparatus for providing heat sinks or heat spreaders for stacked semiconductor devices. Alignment apparatus may be included for the alignment of the stacked semiconductor devices. An enclosure may be used as the heat sink or heat spreader.
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| 申请公布号 |
US6525943(B2) |
申请公布日期 |
2003.02.25 |
| 申请号 |
US20010942247 |
申请日期 |
2001.08.29 |
| 申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
MODEN WALTER L.;CORISIS DAVID J.;KINSMAN LARRY D.;MESS LEONARD E. |
| 分类号 |
H01L23/367;H01L25/10;(IPC1-7):H05K7/20 |
主分类号 |
H01L23/367 |
| 代理机构 |
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