| 摘要 |
Assemblies including semiconductor dice flip-chip connected to one another and packages including the assemblies. The assembly includes a first semiconductor die, such as a logic device, with bond pads arranged in an array on an active surface thereof. The assembly also includes at least one second semiconductor die, such as a memory device or an ancillary or parallel logic device, with bond pads on an active surface thereof. The at least one second semiconductor die is oriented with the active surface thereof facing the active surface of the first semiconductor die. The bond pads of the at least one second semiconductor die are connected to corresponding bond pads of the first semiconductor die by way of conductive structures, such as balls, bumps, columns, or pillars of conductive material, disposed therebetween. The package includes the assembly and a carrier, such as a carrier substrate or leads. The first semiconductor die of the assembly is oriented over the carrier with the active surface of the first semiconductor die facing the carrier. Bond pads of the first semiconductor die that are located laterally outside of the location where a periphery of each second semiconductor die is located upon assembly of the dice are electrically connected to corresponding contacts, such as contact pads of the carrier substrate or the leads themselves, by way of conductive structures, such as balls, bumps, columns, or pillars of conductive material. Methods of forming the assemblies and packages are also disclosed.
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