发明名称 |
Cleaning method for semiconductor manufacturing process to prevent metal corrosion |
摘要 |
A cleaning method for semiconductor manufacturing process. A to-be-cleaned wafer having a metal layer thereon is provided. The wafer is placed into a chemical cleaning equipment unit to clean the wafer surface with a chemical cleaning solution while protecting the metal layer by a cathodic protection method. Next, the chemical cleaning solution on the wafer surface is rinsed away and the wafer is then dried to complete the cleaning method.
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申请公布号 |
US6524965(B2) |
申请公布日期 |
2003.02.25 |
申请号 |
US20010871534 |
申请日期 |
2001.05.31 |
申请人 |
MACRONIX INTERNATIONAL CO., LTD. |
发明人 |
CHEN CHUNG-TAI |
分类号 |
B08B3/10;H01L21/02;H01L21/3213;(IPC1-7):H01L23/48 |
主分类号 |
B08B3/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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