| 摘要 |
A programmable logic device (PLD) includes a die having first and second bond pads, each being weakly pulled to a first voltage. A package enclosing the die has an external pad configured to receive a second voltage. A conductor couples one and only one of the first and second bond pads to the external pad, such that one bond pad is pulled to the first voltage, and the other bond pad is pulled to the second voltage. A logic circuit on the die is coupled the first and second bond pads. The logic circuit enables the PLD to be configured in response to a first type of bit stream if the first bond pad is pulled to the second voltage, and enables the PLD to be configured only in response to a second type of bit stream if the second bond pad is pulled to the second voltage. In another embodiment, a bond pad is weakly pulled to a first voltage, and can be connected or not connected to an external pin for applying a second voltage.
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