| 摘要 |
PURPOSE: A multichip module substrate in which a built-in passive device is contained, as well as a method for manufacturing the substrate, is provided to realize a reduction in size of the substrate. CONSTITUTION: The substrate for a multichip module includes the built-in passive device such as a resistor, a capacitor and/or an inductor formed therein. To manufacture the substrate, the first insulating layer(11) is formed on a base substrate(10). The first seed metal layer(12) and the first main metal layer(13) are then stacked on the first insulating layer(11) to form the first metal layer(14). Next, the second insulating layer(15) having via holes is formed on the first metal layer(14), and the resistor(18) is then selectively formed thereon. Thereafter, the second metal layer(22) composed of the second seed and main metal layers(19,21) is formed on the second insulating layer(15), so that the capacitor is constituted by the first and second metal layers(14,22) and the second insulating layer(15). Then, the inductor is formed by the second metal layer(22), the third insulating layer(23) and the third metal layer(27).
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