发明名称 |
Showerhead electrode design for semiconductor processing reactor |
摘要 |
An electrode assembly of a semiconductor processing chamber wherein heat transfer between a backing plate and a showerhead electrode is improved by an electrostatic clamping arrangement, which includes a compliant material in contact with a surface of the showerhead electrode. The showerhead electrode is removably attached to the backing plate by a mechanical clamping arrangement which engages an outer periphery of the showerhead electrode. The electrostatic clamping arrangement is coextensive with the showerhead electrode to improve thermal conduction between the backing plate and the showerhead electrode. |
申请公布号 |
AU2002318913(A1) |
申请公布日期 |
2003.02.24 |
申请号 |
AU20020318913 |
申请日期 |
2002.07.31 |
申请人 |
LAM RESEARCH CORPORATION |
发明人 |
RAJINDER DHINDSA;ERIC LENZ |
分类号 |
H01L21/3065;C23C16/44;C23C16/455;C23C16/458;C23C16/509;H01J37/32;H01L21/205;(IPC1-7):H01J37/32 |
主分类号 |
H01L21/3065 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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