发明名称 |
PRINTED WIRING BOARD, MULTILAYER PRINTED WIRING BOARD AND MANUFACTURING METHOD THEREFOR |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board in which a product recognition mark can be discriminated easily. SOLUTION: A product recognition mark 85 is formed, by providing a gold plating layer 74 on an opening 81 of a solder resist layer 70. By the layer 74 provided on the opening 81, the difference in the contrast between the mark 85 and the layer 70 can be made large. Accordingly, the mark 85 can be discriminated easily and accurately.</p> |
申请公布号 |
JP2003051650(A) |
申请公布日期 |
2003.02.21 |
申请号 |
JP20010237869 |
申请日期 |
2001.08.06 |
申请人 |
IBIDEN CO LTD |
发明人 |
KAWASAKI YOGO;KOMORI TAKAHIRO |
分类号 |
H05K3/28;H05K1/02;H05K3/46;(IPC1-7):H05K1/02 |
主分类号 |
H05K3/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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