| 摘要 |
PROBLEM TO BE SOLVED: To realize a structure for circuit board, in which the joint force of a connecting part of a land to a base for the circuit board is reinforced, so as to prevent a solder fillet to the land having different thermal expansion coefficients and the land to the base for the circuit board, having thermal elongation and contraction difference of the land and the base from being released, accompanying the temperature difference of the melting temperature of a solder and the temperature for hardening the solder in the structure of the circuit board to be mounting with the electronic component by soldering or a method for manufacturing the same, and to realize the method for manufacturing the circuit board. SOLUTION: The circuit board 10 comprises the base 11, and the pattern material 14 laminated on the base 11 via the resin material 12, in such a manner that the material 14 is compressively strained in a rugged shape in the material 12.
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