PRINTED WIRING BOARD COPPER FOIL AND COPPER-PLATED LAMINATED BOARD USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a copper foil, which is superior both in properties of selectively etching a resistive circuit layer and a copper layer for manufacturing a printed wiring board, and in UL heat resistance. SOLUTION: A printed wiring board copper foil is provided with roughened surface on its one side, a nickel-zinc alloy layer is formed on the roughened surface of the copper foil used for a printed wiring board, and the printed wiring board copper foil is used for solving the problem. At the same time, a suitable method of manufacturing the above copper foil is provided.