发明名称 METHOD FOR MANUFACTURING CONDUCTIVELY CONNECTING STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a conductively connecting structure which can easily conductively connect an electrode in a short time with high connecting reliability, without leakage of the adjacent electrode, when connecting the opposed fine electrodes. SOLUTION: The method for manufacturing the conductively connected structure comprises a step of conductively connecting a plurality of electronic components 3 by using a fine particle-dispersed film 1. The film 1 has conductive fine particles 2 dispersed in a through hole of an adhesive film. The particles 2 are dispersed only at positions, corresponding to the electrode part of the opposed components 3. The method further comprises the steps of confirming the positions of the electrodes 5 of the components 3 and the particles 2 of the film 2 by using a prism camera, and conductively connecting the components 3.
申请公布号 JP2003051661(A) 申请公布日期 2003.02.21
申请号 JP20010236556 申请日期 2001.08.03
申请人 SEKISUI CHEM CO LTD 发明人 FUKUOKA MASATERU;IUCHI KENJI
分类号 C09J7/00;C09J9/02;C09J201/00;H01L21/60;H05K3/32;(IPC1-7):H05K3/32 主分类号 C09J7/00
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