| 摘要 |
PROBLEM TO BE SOLVED: To improve the tensile strength of a printed circuit substrate of an electronic component in the upward direction by raising the connecting strength of the component to the substrate. SOLUTION: A method of mounting the electronic component comprises the steps of making the surface of an electrode 2 of the printed substrate roughened 1, and thereby preferably forming a rough surface having a surface roughness Ra of 0.06 to 10μm. Thus, the tensile strength of the component after mounting is raised. More particularly, it is preferable to execute copper plating or nickel plating of high ion concentration or high current density, and to form the rough surface having the above roughness on the surface of the electrode 2. |
