| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a sensor unit, having a case in which a lead frame is insert molded by reducing a bonding fault. SOLUTION: The method for manufacturing the sensor unit comprises the steps of arranging a support pedestal 5 connected with a sensor element 4 to the lead frame 6, electrically connecting the element 4 to the frame 6 via a wiring 8, and disposing the element 4, the pedestal 5 and the frame 6 in a containing part 3 of a sensor case 2. Thus, even if the element 4 is wire bonded to the frame 6 by ultrasonic bonding, an ultrasonic vibration will not be released to a gap generated between the frame 6 and the case 2, to thereby reduce the bonding defects.
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