发明名称 IMPERVIOUS HEAT-RESERVING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a impervious heat-reserving board at a low cost, having excellent water-impervious heat-resisting properties and capable of being easily recycled as waste paper. SOLUTION: This impervious heat-reserving board has a lamination comprising at least three layers of fibrous material and is characterized by that the second layer from the wrapped package-contacting side contains thermally expandable particles and has 0.2-0.5 g/cm<3> density. And, preferably, the thermally expandable particles are expandable microcapsules having 5-30μm average diameter and expandable to have 4-5 times diameter and 50-130 times volume by heating at 80-200 deg.C and contained at a rate of 1-30 wt.% based on the oven dry basis equivalent weight of the inner layer wet paper.
申请公布号 JP2003049400(A) 申请公布日期 2003.02.21
申请号 JP20010238509 申请日期 2001.08.06
申请人 DAIO PAPER CORP 发明人 KUROKAWA SATORU;MIZOBUCHI HIROSHI;IWAMA FUMIHIRO
分类号 D21H21/54;D21H27/00;(IPC1-7):D21H21/54 主分类号 D21H21/54
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