| 摘要 |
PROBLEM TO BE SOLVED: To economically and surely prevent cracks in a semiconductor wafer, when polishing the rear face of a semiconductor wafer where bumps are formed on the surface. SOLUTION: A resist film 1 is applied onto the surface of a semiconductor wafer W where a plurality of circuits are formed, the resist film 1 at a region, where a plurality of bumps 3 is to be formed corresponding to the circuits is exposed and removed for forming a plurality of pores 2, plating is applied in the pores 2 for forming the plurality of bumps 3, and then the rear face of the semiconductor wafer W is polished, without removing the resist film 1 applied on the surface, while the surface where the resist film 1 is applied is made to face a chuck table and retained.
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