发明名称 |
Composition useful for removing resist layers in the manufacture of semiconductor devices comprises an N-hydroxyalkyl alkoxyalkanamide and a swelling agent |
摘要 |
Resist-removing composition comprises an N-hydroxyalkyl alkoxyalkanamide (I) and a swelling agent. An Independent claim is also included for a process for removing a resist layer from a substrate, comprising contacting the substrate with a composition as above. |
申请公布号 |
FR2828746(A1) |
申请公布日期 |
2003.02.21 |
申请号 |
FR20020010330 |
申请日期 |
2002.08.14 |
申请人 |
SAMSUNG ELECTRONICS CO LTD |
发明人 |
PARK DONG JIN;KIM KYUNG DAE;CHON SANG MUN;HWANG JIN HO;SOHN IL HYUN;PARK SANG OH;JUN PIL KWON |
分类号 |
G03F7/32;C11D1/52;C11D7/26;C11D7/32;C11D7/34;C11D7/50;C11D7/60;C11D11/00;G03F7/42;H01L21/027;H01L21/3065 |
主分类号 |
G03F7/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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