| 摘要 |
PROBLEM TO BE SOLVED: To realize a method of manufacturing a semiconductor device, which can suppress marking errors while working man-hours necessary for marking are reduced, improve the yield, and, further, sort out chips into a plurality of types. SOLUTION: After a wafer is subjected to inspection, inspection results of respective chips are recorded on a rear surface of an expansion sheet, which has the wafer stuck after the inspection and is expanded after the wafer dicing to separate the wafer into individual chips, at positions corresponding to the respective chips. With such a constitution, working man-hours necessary for marking can be reduced and marking errors also can be suppressed. Even if a chip not defective is mistakenly marked as defective, as the mark is not recorded directly on the chip but on the rear side of the expansion sheet, the yield can be improved and the chips can be sorted out into a plurality of types. |
