| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain a thermosetting resin composition whose shock resisting properties, thermal crack resistance, oxidative deterioration resistance and thermal deterioration resistance are improved without losing the heat resisting properties represented by HDT, and which is suitable for sealing a semiconductor, or the like. SOLUTION: This thermosetting resin composition comprises a thermosetting resin and an epoxy group-containing liquid polybutene, and optionally a curing agent. The epoxy group-containing liquid polybutene has an epoxy structure at the molecular terminal of the main component and has a specific chemical structure in >=80% of the recurring units in the main chain structure. Further, the phase structure of the resin of the thermosetting resin composition after hardening reaction is characterized in that dispersed phases of sizes ofμm unit mainly composed of the epoxy group-containing liquid polybutene exist in a continuous phase mainly composed of the thermosetting resin.</p> |
