| 摘要 |
PROBLEM TO BE SOLVED: To provide substrate processing technology capable of decreasing the consumption of an organic solvent. SOLUTION: While nitrogen gas is being supplied from a 1st supply nozzle 40 and a 2nd supply nozzle 50, after a wafer W is cleaned in a processing tank 20, pure water is discharged from the processing tank 20. Then IPA vapor (vapor of organic solvent) is jetted out of the 1st supply nozzle 40 to form an air current area AR of the IPA vapor and the wafer W is lifted so as to pass through the air current area AR. Consequently, the IPA vapor is blown to the substrate W. Thus, the IPA vapor can be supplied efficiently to the wafer W, so the consumption of the organic solvent can be reduced.
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