| 摘要 |
PROBLEM TO BE SOLVED: To obtain a semiconductor device having a lead frame for not sinking the die pad and having a frame easy to form a conductive wiring on the surface for multi-chips. SOLUTION: A method for manufacturing the semiconductor device comprises the steps of forming the lead frame 11 having a through hole 13 at a position for mounting an IC chip, laminating a tape 12 having a holding part 16 for mounting the IC chip on one surface of the frame 11 to form a composite frame, and mounting the IC chip in the hole 13 of the frame 11 on the part 16 of the tape 12. Thus, sink of the die pad from the frame 1 is eliminated, and a dam tie bar for preventing a burr of the mold may not be provided. |
