| 发明名称 |
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING IT |
| 摘要 |
<p>PROBLEM TO BE SOLVED: To suppress increase of a region not filled with adhesive. SOLUTION: This semiconductor device has a wiring substrate, a chip mounting region formed on one main surface of the wiring substrate, and a semiconductor chip bonded to the chip mounting region with adhesive. A pull preventing means which prevents the adhesive from being pulled by a capillary phenomenon between the wiring substrate and the semiconductor chip, is provided in the region of the chip mounting region covered with the adhesive.</p> |
| 申请公布号 |
JP2003051511(A) |
申请公布日期 |
2003.02.21 |
| 申请号 |
JP20010236386 |
申请日期 |
2001.08.03 |
| 申请人 |
HITACHI LTD;HITACHI YONEZAWA ELECTRONICS CO LTD |
发明人 |
TAKAHASHI NORIYUKI;TANAKA KAZUSHI;NAKAJIMA HIDEO |
| 分类号 |
H01L23/12;H01L21/52;(IPC1-7):H01L21/52 |
主分类号 |
H01L23/12 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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