| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a high frequency module component that can enhance the productivity without discrepancy in each manufacturing process, enhance the performance in use and the reliability in use, downsize the product with a low profile where high frequency electronic circuit components including a ceramic multi-layer substrate and a flip-chip mount surface acoustic wave(SAW) element directly mounted thereon particularly have a function of preventing a DC voltage from being applied to the SAW element. SOLUTION: This invention provides a high frequency module component that is configured such that the surface acoustic wave element and other surface mount elements are mounted on a multi-layer substrate, the surface acoustic wave element is directly flip-chip-mounted on an electrode with a metallic film of the multi-layer substrate, and part of a capacitor pattern having a function of preventing application of a DC voltage to the surface acoustic wave element is formed on at least part of the surface acoustic wave element mount area of the multi-layer substrate.</p> |
