| 摘要 |
<p>PROBLEM TO BE SOLVED: To eliminate inconveniences due to the use of an adhesive tape, and to keep retention at a chip section, due to the scattering at a broken section. SOLUTION: A dicing apparatus 100 comprises a wafer loader 11 for supplying a wafer 1, a conveyance arm 12, an alignment stage 13, a conveyance robot 14, a tapeless cut table 15 as a retention means, a cut-off blade 16 as a cut-off means, a pickup stage 17, a pickup robot 18, and a cleaning machine 19. When the dicing apparatus 100 is used for dicing treatment, dicing treatment is carried out, while the chip and broken material sections of the wafer 1 are being retained by vacuum chuck in the tapeless cut table 15. The suction ports of a plurality of vacuum chuck sections, corresponding to the plurality of chip sections and those of the plurality of vacuum chuck sections corresponding to the plurality of broken material sections, are divided and connected to a vacuum system.</p> |
