| 摘要 |
PROBLEM TO BE SOLVED: To provide a punching method and system of a substrate for packaging an electronic component, capable of forming a slit without flashes on a substrate for packaging electronic components, having an adhesive agent layer for packaging electronic components on its reverse side. SOLUTION: A substrate for packaging electronic components comprises at least an insulating film substrate, and a wiring pattern formed thereon. An adhesive layer for mounting electronic components and a protective film bonded to the adhesive layer are laminated on the back side of the substrate. A slit for wire bonding is formed on the substrate for packaging electronic components, using a dice 50 and a punch 40. In such bonding process as described above, at least two sides opposing each other on an opening edge section of a slit-forming hole 51 for forming the slit by the dice 50 has at least a meandering section 61. |
