| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board, having superior insulation between wiring conductors and no fault, such as no disconnection or the like of the wiring conductor, and to provide a method for manufacturing the same and an electronic device. SOLUTION: The circuit board 4 comprises the wiring conductor 2, having an electroless copper plating layer 2a and an electrolytic copper plating layer 2b, laminated sequentially thereon and coating on the upper surface of an insulating substrate 1, in such a manner that the width of the layer 2b of the conductor 2 is 1.01 to 1.25 times as large as that of the layer 2a, and the layer 2b is protruded to both sides in the width direction by covering the upper surface of the layer 2a. |
