| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition for printed circuit boards, a prepreg, a printed circuit board and an interlayer insulation film for buildup board which are excellent in flame retardance, heat resistance and adhesion. SOLUTION: This resin composition for printed circuit boards is characterized by containing (A) a methoxy group-containing silane-modified epoxy resin obtained by carrying out demethanolation-through condensation reaction of (1) unhalogenated bisphenol type epoxy resin with (2) an epoxy compound having one hydroxy group in one molecule and (3) a partial condensation product of methoxysilane and (B) a latent epoxy resin curing agent. This prepreg, this printed circuit board and this interlayer insulation film for buildup board are each obtained by using the resin composition. |
