| 摘要 |
PROBLEM TO BE SOLVED: To obtain a filler of high dielectric permittivity having good dispersibility, to provide a method for producing the same, to obtain a resin composition compounded with the filler of high dielectric permittivity having the good dispersibility, to obtain a resin varnish compounded with the filler, to provide an electronic part obtained by using the same, and to provide a method for producing the electronic part. SOLUTION: The filler comprises a barium titanate power the surfaces of which are treated with a silane coupling agent having a primary amino group. The surfaces of the powder are preferably treated with the silane coupling agent having the primary amino group in the presence of an organic acid. The resin composition to which the filler is added is used for forming an insulating layer of a circuit board, or the like. |
