| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin excellent in development property, flexibility of cured products, heat resistance to soldering, resistance to thermal degradation and resistance to electroless gold plating and especially suitable for solder resists and for interlayer insulation films. SOLUTION: This resin composition comprises (A) an oligomer obtained by reacting (a) an epoxy resin having at least two epoxy groups in one molecule with (b) a compound having two hydroxy groups and one carboxyl group in one molecule, (c) a carboxyl group-containing rubber polymer and optionally (d) a polybasic acid anhydride and (B) a diluent. |
