| 摘要 |
PROBLEM TO BE SOLVED: To provide a tin-bismuth alloy plating apparatus and a plating method therefor by which bismuth can be formed with a composition having a high concentration, and tin-bismuth alloy plating having a stable bismuth concentration can be applied. SOLUTION: In the tin-bismuth alloy plating apparatus 40 provided with an anode 43 and a cathode dipped into a plating solution 41 held in a plating bank 42, and in which voltage is applied to the anode 43 and cathode so that tin-bismuth alloy plating is applied to the member 1 to be plated held in the plating solution 41. In this apparatus, the anode 43 consists of a tin anode 44 made of tin and an insoluble anode 45 which does not dissolve into the plating solution 41, and the area of the insoluble anode 45 is controlled to 70 to 90% of the area of the whole anode 43.
|
