PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR PRODUCING RESIST PATTERN AND METHOD FOR PRODUCING PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition excellent in photosensitivity, resolution, adhesion and solubility in a developing solution and a photosensitive element using the composition. SOLUTION: The photosensitive resin composition comprises (A) a binder polymer, (B) a photopolymerizable monomer containing an ethylenically unsaturated group, (C) a polycyclic aromatic hydrocarbon, (D) a photopolymerization initiator and (E) a hydrogen donor. The photosensitive element is obtained by forming a resist layer comprising the photosensitive resin composition on a support.