| 摘要 |
PROBLEM TO BE SOLVED: To provide an inspection means of a cutting apparatus that can simply inspect a cutting place in a semiconductor wafer by only operating buttons. SOLUTION: A cutting apparatus A places flat work 1 to be machined onto a chuck table 2 on a mobile table 6, cuts the flat work 1 into a lattice shape by a rotary blade 5 and is formed, so that the flat work 1 can be shifted from a cutting position to an inspection one by moving the mobile table 6. At the inspection position, a microscope for monitoring the cutting state of the work 1 to be machined and a spot light 9 are provided. Additionally, an air jet nozzle 10 for scattering cutting liquid, remaining on the surface of the flat work 1 to be machined, is anchored to the cutting apparatus A. By operating an inspection switch 11, the mobile table 6 is moved to the inspection position, so that an air jet due to the air jet nozzle 10 and monitoring due to the microscope and spot light 9 are successively actuated or in synchronism. |
