ADHESIVE FOR CONNECTING CIRCUIT, CONNECTING METHOD USING THE SAME AND CONNECTING STRUCTURE

摘要

PROBLEM TO BE SOLVED: To provide an adhesive for connection of circuits capable of carrying out good connection when a so-called two-layer FPC prepared by directly applying a polyimide resin to copper foil or obtained by electrically forming a circuit on the polyimide resin is used as the substrate and to provide a connecting method using the adhesive and to provide a connecting structure. SOLUTION: This adhesive for connecting circuits is disposed between substrates having opposed circuit electrodes different in height and electrically connects these electrodes in pressurizing direction by heating and pressurizing these substrates and the adhesive has a first adhesive and a second adhesive. In the adhesive, a ratio of thickness of the first adhesive layer to that of the second adhesive layer is 1-10 and an elastic modulus E2 at 80 deg.C of the cured material of the second adhesive layer is 100-1,000 MPa.