| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and an apparatus for plasma processing which can prevent reaction products from sticking on a dielectric plate, reduce loss, and ensure uniformity of the processing. SOLUTION: Through the method and device for plasma processing, which process a substrate by applying a high-frequency voltage to a coil or antenna and introducing electromagnetic waves into a vacuum vessel via the dielectric plate, highly uniform processing is conducted by heating the dielectric plate by a heater 3 composed of bars 11, which have an arc group arranged concentrically around a center right above the center of the substrate and are made successive by connecting ends of arcs, having different diameters along radii and fixing the angle of intersection of the coil or antenna and the bars 11 and high-efficiency processing is conducted by making large the opening rate of a doughnut-shaped area at the outer circumference part. |
