| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat-conductive pressure-sensitive adhesive exhibiting low heat resistance and excellent treatability when being used for a heat- releasing application or the like of a heating element for an electric or electronic part or the like, and further to provide a heat-conductive pressure- sensitive adhesive sheet comprising the adhesive. SOLUTION: This heat-conductive pressure-sensitive adhesive contains (a) 100 pts.wt. copolymer obtained by copolymerizing a copolymerizable monomer mixture comprising an alkyl ester of acrylic acid having a 2-18C alkyl group as an essential component, and having 2,000-300,000 weight average molecular weight, and (b) 10-500 pts.wt. heat-conductive fine particles.
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