发明名称 Methods of forming metal-comprising materials and capacitor electrodes; and capacitor constructions
摘要 The invention includes a method of forming a metal-comprising mass for a semiconductor construction. A semiconductor substrate is provided, and a metallo-organic precursor is provided proximate the substrate. The precursor is exposed to a reducing atmosphere to release metal from the precursor, and subsequently the released metal is deposited over the semiconductor substrate. The invention also includes capacitor constructions, and methods of forming capacitor constructions.
申请公布号 US2003036242(A1) 申请公布日期 2003.02.20
申请号 US20010932236 申请日期 2001.08.16
申请人 YANG HAINING 发明人 YANG HAINING
分类号 C23C16/18;C23C16/455;H01L21/02;H01L21/28;H01L21/285;H01L21/3205;H01L21/768;H01L21/822;H01L21/8242;H01L27/04;H01L27/108;(IPC1-7):H01L21/20 主分类号 C23C16/18
代理机构 代理人
主权项
地址
您可能感兴趣的专利