| 摘要 |
<p>The cooling wall (1) is arranged such that the motherboard (4) and/or all-in-one board and/or slot CPU can be fastened to the wall. The wall has one or more raised portions (2) and/or recesses in the region of the processor or other components whose heat must be dispersed. The height and/or depth of these is such that when the board is mounted, the processor or other component surface lies directly on the surface (3) of the raised portion and/or recess in direct contact. The heat generated can thus be conveyed by heat transfer to the cooling wall. Cooling ribs (11) are arranged on the outer side of the wall, across which cooling air is conveyed by a fan. The cooling air disperses the heat to the surroundings by convection.</p> |
