| 摘要 |
Wafer cleaning systems (10, 25) utilizing both chemical and physical action to clean integrated circuit wafers (14, 24) is disclosed. Chemical cleaning action is provided by liquid retained within a tank (2, 22), sized either to hold a single wafer (24) or a batch of wafers (14) held within a carrier (12). Physical action is provided in the wafer cleaning system either by way of inert gas bubbling through a baffle (5) or by way of ultrasonic energy applied by transducers (28) located in the tank (2, 22). The systems (10, 25) have a programmable controller (20, 30) for initiating the physical cleaning action after insertion of the wafers (14, 24) into the chemical bath, and for ceasing the physical action prior to removal of the wafers (14, 24). After a waiting time after the ceasing of the physical action, to calm the chemical bath and to permit any retained bubbles to escape to the atmosphere, the wafers (14, 24) may then be removed from the chemical bath, with reduced risk of staining and particle release. A recirculating pump (35) and filter (33) system may also be incorporated to clean the chemical bath; during such time as wafers are not present in the chemical bath, the programmable controller (20, 30) may initiate the physical action to assist in cleaning of the tank (2, 22).
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