发明名称 |
HEAT TREATMENT METHOD AND HEAT TREATMENT DEVICE |
摘要 |
A heat treatment method and a heat treatment device,the method comprising the steps of,when treated bodies of less quantity than the maximum treatable quantity thereof in a treated body holder are heat treated,specifying a heat treated body quantity range having the quantity of the treated bodies belonging thereto selectively from one or more treated body quantity ranges having a standard quantity less than the maximum treatable quantity in the treated body holder set as the maximum value,placing the treated bodies according to a placing pattern set in correspondence to the specified treated body quantity range,and heat−treating the treated bodies under the treating conditions pre−set according to the placing pattern;the heat treatment device comprising a controller for implementing the heat treatment method. |
申请公布号 |
WO03015149(A1) |
申请公布日期 |
2003.02.20 |
申请号 |
WO2002JP07974 |
申请日期 |
2002.08.05 |
申请人 |
TOKYO ELECTRON LIMITED;SAKAMOTO, KOICHI;TAKENAGA, YUICHI;YOKOTA, TAKASHI;KAWAMURA, KAZUHIRO |
发明人 |
SAKAMOTO, KOICHI;TAKENAGA, YUICHI;YOKOTA, TAKASHI;KAWAMURA, KAZUHIRO |
分类号 |
F27D19/00;H01L21/00;(IPC1-7):H01L21/31 |
主分类号 |
F27D19/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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