发明名称 HEAT TREATMENT METHOD AND HEAT TREATMENT DEVICE
摘要 A heat treatment method and a heat treatment device,the method comprising the steps of,when treated bodies of less quantity than the maximum treatable quantity thereof in a treated body holder are heat treated,specifying a heat treated body quantity range having the quantity of the treated bodies belonging thereto selectively from one or more treated body quantity ranges having a standard quantity less than the maximum treatable quantity in the treated body holder set as the maximum value,placing the treated bodies according to a placing pattern set in correspondence to the specified treated body quantity range,and heat−treating the treated bodies under the treating conditions pre−set according to the placing pattern;the heat treatment device comprising a controller for implementing the heat treatment method.
申请公布号 WO03015149(A1) 申请公布日期 2003.02.20
申请号 WO2002JP07974 申请日期 2002.08.05
申请人 TOKYO ELECTRON LIMITED;SAKAMOTO, KOICHI;TAKENAGA, YUICHI;YOKOTA, TAKASHI;KAWAMURA, KAZUHIRO 发明人 SAKAMOTO, KOICHI;TAKENAGA, YUICHI;YOKOTA, TAKASHI;KAWAMURA, KAZUHIRO
分类号 F27D19/00;H01L21/00;(IPC1-7):H01L21/31 主分类号 F27D19/00
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