发明名称 PROCESS FOR PREPARING BURIED CONTACT SOLAR CELL
摘要 PURPOSE: A process for preparing buried contact solar cell(BCSC) having low shading loss and electric power loss, thereby having excellent energy conversion efficiency, is provided. CONSTITUTION: The process for preparing buried contact solar cell comprises the steps of texturing the p-type semiconductor substrate(1) to form a pyramid structure on the front and rear surfaces of the substrate(1); diffusing an emitter to the substrate(1) to form p-n bonding; forming an oxide layer(3) on the front surface of the substrate(1); forming grooves on the substrate(1); doping the grooves with n-type impurities; vapor depositing conductive materials on the rear surface of the substrate(1) and then sintering to form back electrode(4); electroless plating with nickel onto the grooves to form nickel plating layer; electroplating with copper on the nickel plating layer to form copper plating layer; and electroless plating with silver onto the copper plating layer to form silver plating layer, thereby forming front electrode(2).
申请公布号 KR100374811(B1) 申请公布日期 2003.02.20
申请号 KR19960037674 申请日期 1996.08.31
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 CHO, YEONG HYEON;KIM, DONG SEOP
分类号 H01M10/04;(IPC1-7):H01M10/04 主分类号 H01M10/04
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