Solder sheet with a bump grid array, process for manufacturing the solder sheet, and process for producing an electronic device using the sholder sheet

摘要

A process for producing a solder sheet with a bump grid array includes the step of molding a sheet of solder material in a mold having two mold halves. Each of the mold halves is formed with an array of first recesses. At least one of the mold halves is further formed with a plurality of second recesses interconnecting adjacent pairs of the first recesses. Each of the first recesses has a depth deeper than that of the second recesses. The first recesses of one of the mold halves are registered with the first recesses of the other of the mold halves such that the first and second recesses of the mold halves cooperatively form a mold cavity defining the shape of the molded solder sheet when the mold halves are brought toward each other to close the mold.