| 发明名称 |
Circuit board and a method for making the same |
| 摘要 |
A method 10, 110 for making multi-layer circuit boards having metallized apertures 38, 40, 130, 132 which may be selectively and electrically grounded and having at least one formed air-bridge 92, 178.
|
| 申请公布号 |
US2003034174(A1) |
申请公布日期 |
2003.02.20 |
| 申请号 |
US20020198341 |
申请日期 |
2002.07.18 |
| 申请人 |
SHI ZHONG-YOU;LI DELIN;MCMILLAN RICHARD |
发明人 |
SHI ZHONG-YOU;LI DELIN;MCMILLAN RICHARD |
| 分类号 |
H05K3/00;H05K3/06;H05K3/40;H05K3/42;H05K3/44;H05K3/46;(IPC1-7):H05K3/20;H01R12/04 |
主分类号 |
H05K3/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
