发明名称 |
High speed, low latency bus modulation method and apparatus including a semiconductor structure for implementing same |
摘要 |
A method and apparatus for bus compression in an array processing system, involving providing a data bus making multiple data bus connections between two separate processing modules; compressing bus signals outputted by at least one of the processing modules with an associated bus modulator effective to permit concurrent transfer of a plurality of bits of information per connection; transferring the compressed signals via the data bus to a bus demodulator associated with the other processing module, wherein the demodulator reconstructs the bus signals before inputting the signals to the other processing module; wherein at least one of the processing modules is formed at least in part in CMOS in a unique semiconductor structure.
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申请公布号 |
US2003036259(A1) |
申请公布日期 |
2003.02.20 |
申请号 |
US20010930275 |
申请日期 |
2001.08.16 |
申请人 |
MOTOROLA, INC. |
发明人 |
TATE LARRY R.;GURNEY DAVID P. |
分类号 |
H01L21/8258;H01L27/06;(IPC1-7):G06F15/00;H01L21/00;H01L21/823 |
主分类号 |
H01L21/8258 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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