发明名称 High speed, low latency bus modulation method and apparatus including a semiconductor structure for implementing same
摘要 A method and apparatus for bus compression in an array processing system, involving providing a data bus making multiple data bus connections between two separate processing modules; compressing bus signals outputted by at least one of the processing modules with an associated bus modulator effective to permit concurrent transfer of a plurality of bits of information per connection; transferring the compressed signals via the data bus to a bus demodulator associated with the other processing module, wherein the demodulator reconstructs the bus signals before inputting the signals to the other processing module; wherein at least one of the processing modules is formed at least in part in CMOS in a unique semiconductor structure.
申请公布号 US2003036259(A1) 申请公布日期 2003.02.20
申请号 US20010930275 申请日期 2001.08.16
申请人 MOTOROLA, INC. 发明人 TATE LARRY R.;GURNEY DAVID P.
分类号 H01L21/8258;H01L27/06;(IPC1-7):G06F15/00;H01L21/00;H01L21/823 主分类号 H01L21/8258
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