Verfahren zum Verkappen eines Chipkarten-Moduls und Chipkarten-Modul

摘要

In a process for capping a chip card module by low pressure injection moulding of thermosetting material onto a substrate with one or more IC chips or other active or passive electronic components, the novelty is that (a) anchoring cavities, which widen in the direction from the surface, are produced in the surface of the non-metallic card substrate prior to injection moulding; and (b) the low pressure moulding material is injected into the cavities to form a locking joint preventing lifting of the finished cap from the surface. Also claimed is a chip card module made by the above process, in which the substrate pref. consists of an epoxide-glass fibre mixt.