发明名称 |
Cleaning substrate for cleaning and regenerating a mold |
摘要 |
A cleaning substrate for cleaning and regenerating a mold is disclosed. The mold is contaminated after repeatedly packaging the semiconductor device by making use of thermosetting resin. At least a protrusion of the substrate can substantially match with and be contained within the edges of the mold cavity of the mold when the cleaning substrate is placed in the mold.
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申请公布号 |
US2003034049(A1) |
申请公布日期 |
2003.02.20 |
申请号 |
US20010928991 |
申请日期 |
2001.08.15 |
申请人 |
ADVANCED SEMICONDUCTOR ENGINEERING, INC. |
发明人 |
CHOU KUANG CHUN |
分类号 |
B29C33/72;B29C45/14;(IPC1-7):B29C33/40 |
主分类号 |
B29C33/72 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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