METHOD FOR MANUFACTURING THIN−FILM STRUCTURE

摘要

A method for manufacturing a thin−film structure which enables removal of a sacrificial film without removing the other insulating films.Two etching steps are adopted for the sacrificial film(51)to form an anchor hole(52)which opens in the surface of a wiring(45).In the first etching step,with the sacrificial film(51)left,the sacrificial film(51)is partially removed by anisotropic etching above the wiring(45).In the second etching step,the left sacrificial film(51)is removed by isotropic wet etching above the wiring(45).