BALL MULTI NOZZLE OF SOLDER BALL ATTACHMENT APPARATUS AND METHOD FOR ATTACHING BALLS OF BGA PACKAGE

摘要

PURPOSE: A ball multi nozzle of a solder ball attachment apparatus and a method for attaching balls of a BGA(Ball Grid Array) package are provided to form accurately the BGA package by attaching correctly the solder balls on an upper portion of a flux formed on a strip pattern. CONSTITUTION: A plurality of solder balls(500) are absorbed into a plurality of nozzle pins(541) when a plurality of ball multi nozzles(540) approaches a ball insert plate(520) including the solder balls(500). The nozzle pins(541) are projected from a body of the ball multi-nozzle(540). A tube portion is formed in the inside of the nozzle pin(541) in order to absorb easily the solder balls(500). The solder balls(500) are correctly attached on a flux dot of an upper portion of a strip pattern after the solder balls(500) are absorbed by the ball multi nozzle(540).